MARKETS

We provide a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates.

Main fields of application

Semiconductor process equipment

• Resist processing: open bowl, CCP & spray coating
• Temperature processing: HMDS, hotplate, cool-plate & RTP
• Gas phase processing: cleaning & etching
• Wet processing: developing, etching, cleaning, stripping & metal lift-off
• Post Chemical Mechanical Polishing Clean (CMP)
• Spin on glass (SOG), on dielectric (SOD) cluster systems
• Cluster systems to adapt with other modules

Flat panel display equipment

• Resist-, wet- & temperature processing

MEMS equipment

• Resist-, wet- & temperature processing
• Cleaning & Post CMP Clean
• Temporary bonding & debonding

Nanotechnology equipment (Graphene & Nanotubes)

• Graphene transfere system
• Coating, cleaning & etching
• Temporary bonding & debonding Packaging equipment
• Coating, developing & etching
• Dispensing systems

Printed, Organic, Flexible

• Injet printing systems (in collaboration with with NOTION Systems)
• Equipment: Printing, coating & transport systems

Components

• Chucks for wafer & other substrates

Sub-systems

• Dispense systems: Fluid pumps, syringes & others
• Vacuum drying & out gassing systems