MARKETS
We provide a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates.
Main fields of application
Semiconductor process equipment
÷ Resist-, Wet-, Temperature- and Gas phase substrate processing
÷ Post Chemical Mechanical Polishing Clean (CMP)
÷ Spin on glass (SOG), on dielectric (SOD) cluster systems
MEMS equipment
÷ Resist-, Wet- and Temperature- processing
÷ Cleaning and Post CMP Clean
÷ Temporary bonding & Debonding
Flat panel display equipment
÷ Resist-, Wet- and Temperature processing
Nanotechnology equipment (Graphene & Nanotubes)
÷ Graphene transfer system
÷ Coating, cleaning and etching
÷ Temporary bonding & Debonding
Packaging equipment
÷ Coating, developing and etching
÷ Dispense systems
Chemicals & Solids
÷ Solvent based adhesive
÷ Water based adhesive
÷ Specialty layers
Components
÷ Chucks for wafer and other substrates
÷ Spare parts
Sub-systems
÷ Dispense systems: Fluid pumps, syringes and others
÷ Vacuum drying and out gassing systems