photolithography processing systems

for markets such as semiconductor, MEMS, glass and optical component industries and flat panel industries.

MARKETS

We provide a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates.

Main fields of application



 


Semiconductor process equipment

  • Resist processing: open bowl, CCP & spray coating
  • Temperature processing: HMDS, hotplate, cool-plate & RTP
  • Gas phase processing: cleaning & etching
  • Wet processing: developing, etching, cleaning, stripping & metal lift-off
  • Post Chemical Mechanical Polishing Clean (CMP)
  • Spin on glass (SOG), on dielectric (SOD) cluster systems
  • Cluster systems to adapt with other modules

Flat panel display equipment

  • Resist-, wet- & temperature processing

MEMS equipment

  • Resist-, wet- & temperature processing
  • Cleaning & Post CMP Clean
  • Temporary bonding & debonding

Nanotechnology equipment (Graphene & Nanotubes)

  • Graphene transfere system
  • Coating, cleaning & etching
  • Temporary bonding & debonding Packaging equipment
  • Coating, developing & etching
  • Dispensing systems

Printed, Organic, Flexible

  • Injet printing systems (in collaboration with with NOTION Systems)
  • Equipment: Printing, coating & transport systems

Components

  • Chucks for wafer & other substrates

Sub-systems

  • Dispense systems: Fluid pumps, syringes & others
  • Vacuum drying & out gassing systems


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