PRODUCTS
Resist Processing
Automatic production systems
VARIXX-SERIES
- Flexible configuration of processing modules
- Available modules: spin coater, developer, temperature and smart-EBR
- Handling thin, standard or bonded wafer (Si, glass & others)
- Round wafer up to Ø300 mm (Ø12 inch)
- Square substrates size up to 230 x 230 mm (9 x 9 inch)
Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.
Designed to be used in applications:
SPIN (SPRAY) COATING, DEVELOPING, BAKING AND EBR
VARIXX 804
(Ø200mm) with 4 process modules
VARIXX 806
(Ø200mm) with 6 process modules
VARIXX 1204
(Ø300mm) with 4 process modules
Semi-automatic production systems
UNIXX-SERIES
- Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone, table-top or bench mounted configurations.
- Base frame design allows various process modules configurations.
- Round wafer up to Ø300 mm (Ø12 inch)
- Square substrate size up to 230 x 230 mm (9 x 9 inch)
Our product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch).
Optional sub-systems; PR dispense systems (pumps, syringe or CPD).
Designed to be used in applications:
SPIN OR SPRAY COATING, DEVELOPING, BAKING & COOLING AND EBR
SPIN COATER - CCP
UNIXX S760+
(21x21 inch) Stand-alone system
spin coater for large substrates.
UNIXX SA30+
(Ø300mm) Stand-alone system with
covered chuck spin coater. (single base frame)
UNIXX SH22+
(Ø200mm) Stand-alone system with
covered chuck spin coater & hotplate module.
SPIN COATER - open bowl
UNIXX SA30
(Ø300mm) Stand-alone system with
open bowl spin coater. (single base frame)
UNIXX SH22
(Ø200mm) Stand-alone system with
open bowl spin coater & hotplate module.
DEVELOPER
UNIXX DH20
(Ø200mm) Stand-alone system for developing or etching.
EBR
UNIXX EBR A20
(200x200mm) Stand-alone smartEBR system.(single base frame)
HOTPLATES
UNIXX H760
(21x21 inch) Stand-alone system for large substrates.
UNIXX H45
(Ø450mm) Stand-alone system up to 320 x 320mm square substrates.
UNIXX HVA20
(Ø200mm) Stand-alone system for HMDS priming and vacuum dehydration bake.
UNIXX HTe20
(Ø200mm) Table-top tool with electronic driven lifting pins. (or bench mounted)
UNIXX HTp20
(Ø200mm) Table-top tool with pneumatic driven lifting pins. (or bench mounted)
SPRAY COATER
3D & 2D SPRAY COATER SYSTEM for flat, concave or convex surfaces
- For large scale optical devices and substrates up to 21‟x 21‟
- 6 axis robot system & up to 2 ultra-sonic spray nozzles
- Integrated heating chuck under the spray coating area
SPRAY COATER MODULE for surfaces with topographic structure
- Wafer size up to Ø 300 mm (Ø12‟)
- Module can be installed in automatic systems
Optional sub-systems; PR dispense systems (pumps, syringe, CPD).
UNIXX SP760
(21”x 21”) Stand-alone system with integrated heating chuck.
UNIXX SP45
(Ø450mm) 3D Spray coater stand-alone system for concave or convex surfaces.
UNIXX SP B20
(Ø200mm)
Bench mounted spray coater module.
Laboratory spinner systems
BASIXX-SERIES
- Software control with recipe management function
- Transparent cover with safety interrupt sensor
- Solvent injection over puddle nozzle
- Process bowl and splash ring removable for cleaning
- Round wafer up to Ø200mm (Ø8 inch)
- Square substrates size up to 150 x 150 mm (6 x 6 inch)
- Available as bench mounted, table-top or stand-alone unit
- Simply and cost-effective
Optional (+) electric media arm
ADDITIONAL OPTIONS
- Media pump PD-10 for PR
- Media- and waste tanks
- External media supply (e.g. N2)
Designed to be used in applications:
SPIN COATING, DEVELOPING, CLEANING AND DRYING
BASIXX ST20+
(Ø200mm) Table top tool with electric media arm.
BASIXX SB20+
(Ø200mm) Bench mounted module with electric media arm.
BASIXX ST20
(Ø200mm) Table top tool with simple dispense over one puddle nozzle.
BASIXX SH22
(Ø200mm) Stand-alone system with simple dispense over one puddle nozzle and hotplate module.
WET PROCESSING
Semi- or fully-automatic production systems
CHEMIXX-SERIES
MECHANICAL PROCESSING
- High pressure nozzle
- Megasonic or ultra-sonic nozzle
- Large area megasonic
- Single or double-sided brush
CHEMICAL PROCESSING
- SPM, SC1, SC2, DHF
- BHF, SiO2, Metal etch
- Chemicals via puddle or spray nozzle
Pre-defined systems for standard processes such as mask cleaning,
metal lift-off, post CMP clean and scrubbers or customized tools.
Designed to be used in applications:
WET CLEANING, ETCHING, POST CMP CLEAN AND METAL LIFT-OFF
CHEMIXX CL30pm
(Ø300mm) Wet cleaning system with
DI-Chamber rinse (optional).
CHEMIXX CMP30pm
(Ø300mm) Wet cleaning system for cleaning of dry and wet wafers after CMP.
CHEMIXX E 30 MASK
(9 x 9 inch) Photomask cleaning system.
CHEMIXX 760
(21x 21 inch) Single processing cleaning, etching or developing system with integrated media supply.
CHEMIXX 801
(Ø200mm) Automatic etching processing
system with one process chamber.
CHEMIXX 803
(Ø200mm) Automatic wet processing
system with three process chamber.
TEMPORARY BONDING
Manual to automatic production systems
AFIXX-SERIES
- Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
- Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials.
- Compatible with silicon, compound and glass materials
- Uniform and repeatable mounting process is ideal for CMP, grinding, polishing and etching.
Temporary bonding material mroBOND L1.1.DS are organic coatings that enable back-end-of-line (BEOL) processing of ultra-thin wafers using standard semiconductor equipment.
MOUNTING ONTO DIFFERENT TYPES OF CARRIER SUBSTRATES: GLASS, SAPPHIRE, SILICON OR CERAMIC.
Designed to be used in applications:
TEMPORARY BONDING
AFIXX 22a
(Ø200mm) Automatic system with
hotplate & I/O stations.
AFIXX 30s
(Ø300mm) Semi-automatic system
with 200ºC hotplate.
AFIXX 20m
(Ø200mm) Manual system with 200ºC hotplate.
DEBONDING
Manual to automatic production systems
DEFIXX-SERIES
- Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
- Imbedded heaters on wafer and carrier plates
- Compatible with silicon, compound and glass materials
- Usable with a wide range of debonding materials
It is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production.
DEMOUNTING OF BACKSIDE GROUND, THINNED AND POLISHED WAFERS.
Designed to be used in applications:
DEBONDING
DEFIXX 30m
(Ø300mm) Manual system
DEFIXX 15m
(Ø150mm) Manual system
SUB-SYSTEMS
In addition to our processing systems Osiris International also offers sub-systems (e.g. dispense systems, media supply cabinets with various canister designs).
Dispense systems
OOPXX
Oyster dispensing pump
100 / 200 ml
PD-10
Osiris Diaphragm Pump
for solvents up to photoresist
Syringe
Motorized syringe dispense system
50 ml
Media supply cabinets
Active media cabinet
Storage up to three acid-canister
PE-HD 10 ltr. tank