PRODUCTS

Resist Processing

Automatic production systems

VARIXX-SERIES
÷ Flexible configuration of processing modules
÷ Available modules: spin coater, developer, temperature and smart-EBR
÷ Handling thin, standard or bonded wafer (Si, glass & others)
÷ Round wafer up to Ø300 mm (Ø12 inch)
÷ Square substrates size up to 230 x 230 mm (9 x 9 inch)

Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.

Designed to be used in applications:
SPIN (SPRAY) COATING, DEVELOPING, BAKING AND EBR

VARIXX 804
(Ø200mm)
with 4 process modules

VARIXX 806
(Ø200mm)
with 6 process modules

VARIXX 1204
(Ø300mm)
with 4 process modules

Semi-automatic production systems

UNIXX-SERIES
÷ Spin & spray coater, developer, temperature and smartEBR modules are
available as stand-alone, table-top or bench mounted configurations.
÷ Base frame design allows various process modules configurations.
÷ Round wafer up to Ø300 mm (Ø12 inch)
÷ Square substrate size up to 230 x 230 mm (9 x 9 inch)

Our product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch).
Optional sub-systems; PR dispense systems (pumps, syringe or CPD).

Designed to be used in applications:
SPIN OR SPRAY COATING, DEVELOPING, BAKING & COOLING AND EBR

UNIXX SH22+
(Ø200mm)
Stand-alone system with covered cuck coater & hotplate module

UNIXX SH22
(Ø200mm)
Stand-alone system with open bowl coater & hotplate module

UNIXX H45
(17x17inch)
Stand-alone system with hotplate module

UNIXX HT20e
(Ø200mm)
Table-top temperature system

UNIXX-SP (SPRAY COATER)
3D & 2D SPRAY COATER SYSTEM for flat, concave or convex surfaces
÷ For large scale optical devices and substrates up to 21 x 21 inch
÷ 6 axis robot system & up to 2 ultra-sonic spray nozzles
÷ Integrated heating plate under the spray coating area

INLINE SPRAY COATER MODULE for flat surfaces
÷ Wafer size up to Ø 300 mm (Ø12 inch)
÷ Module can be installed in automatic systems

Optional sub-systems; PR dispense systems (pumps, syringe, CPD).

Designed to be used in applications:
SPRAY COATING

UNIXX SP45
(Ø450mm)
3D Spray coater system for concave or convex surfaces.

UNIXX SP760
(21x21 inch)
Stand-alone system with
integrated heating plate.

Laboratory spinner systems

BASIXX-SERIES
÷ Software control with recipe management function
÷ Transparent cover with safety interrupt sensor
÷ Solvent injection over puddle nozzle
÷ Process bowl and splash ring removable for cleaning
÷ Round wafer up to Ø200mm (Ø8 inch)
÷ Square substrates size up to 150 x 150 mm (6 x 6 inch)
÷ Available as bench mounted, table-top or stand-alone unit
÷ Simply and cost-effective

Optional electric media arm with z-axis movement and PR dispense systems.

Designed to be used in applications:
SPIN COATING, DEVELOPING, CLEANING AND DRYING

BASIXX ST20+
(Ø200mm)
Table top system
spin coater with electric media arm

BASIXX ST20
(Ø200mm)
Table top system
spin coater

BASIXX SH22
(Ø200mm)
Stand-alone system
spin coater & hotplate module

BASIXX DH22
(Ø200mm)
Stand-alone system
developer & hotplate
module

WET PROCESSING

Semi- or fully-automatic production systems

CHEMIXX-SERIES
MECHANICAL PROCESSING
÷ High pressure nozzle
÷ Megasonic or ultra-sonic nozzle
÷ Large area megasonic
÷ Single or double-sided brush

CHEMICAL PROCESSING
÷ SPM, SC1, SC2, DHF
÷ BHF, SiO2, Metal etch
÷ Chemicals via puddle or spray nozzle

Pre-defined systems for standard processes such as mask cleaning, metal lift-off, post CMP clean and scrubbers or customized tools.

Designed to be used in applications:
WET CLEANING, ETCHING, POST CMP CLEAN AND METAL LIFT-OFF

CHEMIXX 30pm
(up to Ø300mm)
Wet cleaning system

CHEMIXX CMP 30pm
(Ø300mm)
Wet processing system for cleaning CMP wafers.

CHEMIXX MASK30
(9x9inch)
Mask cleaning system

CHEMIXX 802
(Ø200mm)
Eching & wet cleaning system

CHEMIXX 760
Stand-alone system for substrates up to 21x 21 inch with integrated media supply

TEMPORARY BONDING

Manual to automatic production systems

AFIXX-SERIES
÷ Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
÷ Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials.
÷ Compatible with silicon, compound and glass materials
÷ Uniform and repeatable mounting process is ideal for CMP, grinding,
polishing and etching.

Temporary bonding material mroBOND L1.1.DS are organic coatings that enable back-end-of-line (BEOL) processing of ultra-thin wafers using standard semiconductor equipment.

MOUNTING ONTO DIFFERENT TYPES OF CARRIER SUBSTRATES: GLASS, SAPPHIRE, SILICON OR CERAMIC.

Designed to be used in applications:
TEMPORARY BONDING

AFIXX 22a
(Ø200mm)
Automatic system with
hotplate & I/O stations.

AFIXX 30s
(Ø300mm)
Semi-automatic system with 200ºC hotplate.

AFIXX 20m
(Ø200mm)
Manual system with 200ºC hotplate.

DEBONDING

Manual to automatic production systems

DEFIXX-SERIES
÷ Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
÷ Imbedded heaters on wafer and carrier plates
÷ Compatible with silicon, compound and glass materials
÷ Usable with a wide range of debonding materials

It is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production.

DEMOUNTING OF BACKSIDE GROUND, THINNED AND POLISHED WAFERS.

Designed to be used in applications:
DEBONDING

DEFIXX 20a
(Ø200mm)
Automatic system with
hotplate & I/O stations.

DEFIXX 30s
(Ø300mm)
Semi-automatic system

DEFIXX 30m
(Ø300mm)
Manual system

SUB-SYSTEMS

In addition to our processing systems Osiris International also offers sub-systems (e.g. dispense systems, media supply cabinets with various canister designs).