optimized system solutions for various markets such as

semiconductor, MEMS, security printing and nanotechnology

PRODUCT CATEGORIES

Semiconductor process equipment

÷ Resist processing: open bowl, CCP & spray coating
÷ Temperature processing: HMDS, hotplate, cool-plate & RTP
÷ Gas phase processing: cleaning & etching
÷ Wet processing: developing, etching, cleaning, stripping & lift-off
÷ Post Chemical Mechanical Polishing Clean (CMP)
÷ Spin on glass (SOG), on dielectric (SOD) cluster systems
 

Flat panel display equipment

÷ Resist-, wet- & temperature processing
 

MEMS equipment

÷ Resist-, wet- & temperature processing
÷ Cleaning & Post CMP Clean
÷ Temporary mounting & demounting
 

Nanotechnology equipment (Graphene & Nanotubes)

÷ Graphene transfere system
÷ Coating, cleaning & etching
÷ Temporary mounting & demounting
 

Packaging equipment

÷ Flip-chip & pick and place
÷ Coating, developing & etching
÷ Dispensing systems
 

Chemicals & Solids

÷ Solvent-based adhesive
÷ Water-based adhesive
÷ Specialty layers
 

Components

÷ Chucks for wafer & other substrates
 

Sub-systems

÷ Dispense systems: Fluid pumps, syringes & others
÷ Vacuum drying & out gassing systems