VARIXX-SERIES

• Flexible configuration of processing modules
• Available modules: spin coater, spray coater, developer, temperature and smart-EBR
• Handling thin, standard or bonded wafer (Si, glass & others)
• Round wafer up to Ø300 mm (Ø12 inch)
• Square substrates size up to 230 x 230 mm (9 x 9 inch)

Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.

VARIXX 804 
(Ø200mm) with 4 process modules

VARIXX 806 
(Ø200mm) with 6 process modules

VARIXX 1204 
(Ø300mm) with 4 process modules

UNIXX-SERIES

• Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone, table-top or bench mounted configurations.
• Base frame design allows various process modules configurations.
• Round wafer up to Ø300 mm (Ø12 inch)
• Square substrate size up to 230 x 230 mm (9 x 9 inch)

Our product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch).

Optional sub-systems; PR dispense systems (pumps, syringe or CPD).

UNIXX S760+
(21x21 inch) Stand-alone system
spin coater for large substrates.

UNIXX SA30+ 
(Ø300mm) Stand-alone system with
covered chuck spin coater. (single base frame)

UNIXX SHp22+
(Ø200mm) Stand-alone system with
covered chuck spin coater & hotplate module.

UNIXX SA30
(Ø300mm) Stand-alone system with
open bowl spin coater. (single base frame)

UNIXX SHe22 
(Ø200mm) Stand-alone system with
open bowl spin coater & hotplate module.

UNIXX D20 Advanced
(Ø200mm) Stand-alone system with movable splash ring for manual load-/unload of single substrates.

UNIXX D30 Standard
(Ø300mm) Stand-alone system provide users
in science, and research with a productive, safe and clean system.

UNIXX EBR A20
(200x200mm) Stand-alone smartEBR system.(single base frame)

UNIXX H1403
(40x40 inch) Stand-alone hotplate system with 3 hotplate modules up to 1.000 x 1.000mm substrates.

UNIXX H760
(21x21 inch) Stand-alone hotplate system up to 537 x 537mm or customized rectangular substrates.

UNIXX He45 
(Ø450mm) Stand-alone hotplate system for round or up to 320 x 320mm square
substrates.

UNIXX HvT20 
(Ø200mm) Table-top hotplate tool for HMDS priming and vacuum dehydration bake.
(available bench mounted or stand-alone)

UNIXX HeT20 
(Ø200mm) Table-top hotplate tool with electronic driven lifting pins.
(or bench mounted)

UNIXX HpT20 
(Ø200mm) Table-top hotplate tool with pneumatic driven lifting pins.
(or bench mounted)

UNIXX SP 760
(21x21 inch) Spray coater system with integrated heating chuck for large substrates.

UNIXX SP H22
(Ø200mm) Spray coater system with hotplate module.

UNIXX SP B20
(Ø200mm)
Bench mounted spray coater module.

CHEMIXX-SERIES
MECHANICAL PROCESSING

• High pressure nozzle
• Megasonic or ultra-sonic nozzle
• Large area megasonic
• Single or double-sided brush

 
CHEMICAL PROCESSING

• SPM, SC1, SC2, DHF
• BHF, SiO2, Metal etch
• Chemicals via puddle or spray nozzle

Pre-defined systems for standard processes such as mask cleaning,
metal lift-off, post CMP clean and scrubbers or customized tools.

CHEMIXX CL30pm
(Ø300mm) Wet cleaning system with
DI-Chamber rinse (optional).

CHEMIXX CMP30
(Ø300mm) Wet cleaning system for cleaning of dry and wet wafers after CMP.

CHEMIXX E 30 MASK
(9x9 inch) Photomask cleaning system.
 

CHEMIXX 760
(21x21 inch) Single processing cleaning, etching or developing system with integrated media supply for large substrates.

CHEMIXX 1201
(Ø300mm) Automatic cleaning, etching or developing processing system with one process chamber.

AFIXX-SERIES

• Wafer sizes from pieces up to Ø200 mm (Ø8 inch)
• Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials.
• Compatible with silicon, compound and glass materials
• Uniform and repeatable mounting process is ideal for CMP, grinding, polishing and etching.

AFIXX 22a
(Ø200mm) Automatic system with
hotplate & I/O stations.

AFIXX 20s
(Ø200mm) Semi-automatic system
with 200ºC hotplate.

AFIXX 20m
(Ø200mm) Manual system with 200ºC hotplate.

DEFIXX-SERIES

• Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
• Imbedded heaters on wafer and carrier plates
• Compatible with silicon, compound and glass materials
• Usable with a wide range of debonding materials

DEFIXX 20a
(Ø200mm) Automatic system with robot loading and unloading. (cassette to cassette)

DEFIXX 20s
(Ø200mm) Semi-automatic system with manual loading and unloading station.

DEFIXX 30m
(Ø300mm) Manual system with imbedded heaters on wafer and carrier plates.

DEFIXX 15m
(Ø150mm) Manual system with imbedded heaters on wafer and carrier plates.

In addition to our processing systems Osiris International also offers sub-systems (e.g. dispensing systems, media supply cabinets with various canister designs).

OOPXX
Oyster dispensing pump
(max. dispense volume 100ml or 200ml)

For high material viscosity:
Photoresist positive & negative, bonding material or solvent.

• Programmable  pressure, rate and speed
• Incl. suck-back valve
   
  

PD-10
Pneumatic diaphragm pump system
Handles a wide range of media viscosities, from solvents up to photoresist.

FOR APPLICATIONS

• Photoresist coating for SEMI applications
• Edge cleaning with solvents
• Protective coating

Syringe
Automatic syringe dispense system
Dispensing of small media amounts or continuous dispense for μl/sec or any ml/sec

• Syringe made of glass or one-way syringe of plastic
• Different syringe sizes available: 10ml, 20ml, 50ml, 100ml and 200ml
• Programmable suck-back volume and rate

Active media cabinet
Storage up to three acid-canister
PE-HD 10 ltr. tank

Various media canister designs

• Canister sizes: 5, 10, 20 ltr.
• Canister Materials: SS, PP, HDPE, PVDF
• Media can be heated or temperature stabilized
• Continuous Pump with ultrasonic flow sensor or pressurized tank with manual flow mtr.